IMOS$25.76
$28.03
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Powered by LiveAIOverall Analysis
BuyChipMOS TECHNOLOGIES INC. exhibits strong profitability and a solid balance sheet, but its market capitalization is relatively small. The company operates in the semiconductor industry, benefiting from demand in consumer electronics and communication equipment, but faces intense competition. Its dividend yield is attractive. Recent technical indicators suggest a cautious outlook.
Thematic
ChipMOS operates within the semiconductor sector, which is influenced by global technology trends, consumer electronics demand, and the automotive industry. While it serves these sectors, it does not appear to be at the forefront of disruptive thematic trends like AI infrastructure or advanced cloud computing.
Fundamental
ChipMOS demonstrates robust profitability and a strong balance sheet, with a significant amount of cash. The company has a history of paying dividends. However, revenue and net income have shown a downward trend in recent years, and the P/E ratio suggests it might be undervalued compared to its earnings.
Technical
The stock price has experienced a significant decline over the past year. While current price action shows some stabilization, key moving averages are trending downwards, and oscillators indicate a neutral to slightly bearish sentiment. Support levels are being tested.
| Factor | Score |
|---|---|
| Semiconductor Industry Trends | 70 |
| Consumer Electronics Demand | 75 |
| AI & High-Performance Computing | 40 |
| Automotive Technology | 50 |
| Geopolitical & Supply Chain Risks | 60 |
| Factor | Score |
|---|---|
| Valuation | 80 |
| Profitability | 60 |
| Growth | 50 |
| Balance Sheet Health | 95 |
| Cash Flow | 70 |
| Dividend Yield | 90 |
| Factor | Score |
|---|---|
| Trend Analysis | 40 |
| Momentum | 55 |
| Volume Confirmation | 50 |
| Support & Resistance | 60 |
| Short-Term Oscillators | 50 |
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Powered by LiveAIBullish Points (6)
Attractive Valuation Metrics
The Price-to-Earnings (P/E) ratio on a trailing twelve months (TTM) basis is 13.53, which is relatively low compared to the industry average, suggesting potential undervaluation. The Price-to-Sales (P/S) ratio is also low, indicating the company is generating revenue efficiently relative to its stock price.
Strong Dividend Yield
The dividend yield is 6.59%, which is a strong indicator of shareholder return. The consistent dividend payments and the upcoming ex-dividend date of 2025-06-27 suggest a commitment to returning value to shareholders.
Bearish Points (7)
Declining Short-Term Performance
The stock has experienced negative performance over the last 1 month (-3.68%) and 6 months (-5.94%), indicating recent weakness and potential headwinds.
Slowing Revenue and Profit Growth
Revenue and net income have shown a declining trend from 2021 to 2024. For instance, net margin decreased from 18.0% in 2021 to 6.3% in 2024, suggesting challenges in maintaining previous growth rates.
Calendar
June 2025
27
Ex-Dividend Date
July 2025
25
Next Dividend Date
August 2025
11
Next Earnings Date
H: $
A: $
L: $
H: 5.69B
A: 5.69B
L: 5.69B
Profile
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.